Uusi opinto-opas (sisältäen myös opetusohjelmat) lukuvuodelle 2018-2019 sijaitsee osoitteessa https://opas.peppi.utu.fi . Tältä sivustolta löytyvät enää vanhat opinto-oppaat ja opetusohjelmat.

The new study guide (incl. teaching schedules) for academic year 2018-2019 can be found at https://studyguide.utu.fi. This site contains only previous years' guides.

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Archived Curricula Guide 2013–2014
Curricula Guide is archieved. Please refer to current Curricula Guides
ETT_2065 3D integration and System on Package 5 ECTS
Organised by
Electronics and Communication Technology

Learning outcomes

Understanding of 3-dimensional integration and packaging in microelectronics.

Contents

Physical and electric principles of 3D integration, wire bonding, Tape Automated Bonding, Flip Chip bonding and wafer-level packaging. Electrical package design, thermal management, reliability, passive and optoelectronic components, MEMS, sealing and encapsulation, PWB technologies, board assembly, electrical testing.

Modes of study

Option 1
Available for:
  • Degree Programme Students
  • Other Students
  • Doctoral Students
  • Exchange Students
Written exam
  • In English
Oral exam
  • In English
English:
Written exam and Oral presentation

Evaluation

Numeric 0-5.

Belongs to following study modules

Department of Future Technologies
2013–2014
Teaching
Archived Teaching Schedule. Please refer to current Teaching Shedule.
Implementation details are unavailable.
Department of Future Technologies
DP in Computer Science
DP in Electr. and Communication Technology
Finnish Study Modules