Uusi opinto-opas (sisältäen myös opetusohjelmat) lukuvuodelle 2018-2019 sijaitsee osoitteessa https://opas.peppi.utu.fi . Tältä sivustolta löytyvät enää vanhat opinto-oppaat ja opetusohjelmat.

The new study guide (incl. teaching schedules) for academic year 2018-2019 can be found at https://studyguide.utu.fi. This site contains only previous years' guides.

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Arkistoitu opetussuunnitelma 2013–2014
Selaamasi opetussuunnitelma ei ole enää voimassa. Tarkista tiedot voimassa olevasta opetussuunnitelmasta.
ETT_2065 3D integration and System on Package 5 op
Organised by
Electronics and Communication Technology

Learning outcomes

Understanding of 3-dimensional integration and packaging in microelectronics.

Contents

Physical and electric principles of 3D integration, wire bonding, Tape Automated Bonding, Flip Chip bonding and wafer-level packaging. Electrical package design, thermal management, reliability, passive and optoelectronic components, MEMS, sealing and encapsulation, PWB technologies, board assembly, electrical testing.

Modes of study

Option 1
Available for:
  • Degree Programme Students
  • Other Students
  • Doctoral Students
  • Exchange Students
Written exam
  • In English
Oral exam
  • In English
English:
Written exam and Oral presentation

Evaluation

Numeric 0-5.

Belongs to following study modules

Tulevaisuuden teknologioiden laitos
2013–2014
Teaching
Archived Teaching Schedule. Please refer to current Teaching Shedule.
Implementation details are unavailable.
Tulevaisuuden teknologioiden laitos
Opintokokonaisuudet